Insulating solid crystal adhesive
ZJ-EPDAN01 is a single component solvent-free insulation adhesive based on epoxy resin, used for solid crystal mounting of electronic components such as IC chips.
Product features
1) High bonding strength
2) Good electrical insulation performance
3) Suitable for high-speed dispensing
4) Low impurity ion content
5) Low resin overflow
| Classification |
Properties |
Unit |
Index |
Test Method |
|
| Properties before curing |
Appearance |
--- |
white |
Visual |
|
|
Viscosity 5rpm@25℃ |
Pa・S |
12±2 |
Brookfield Viscometer |
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|
Thixotropic Index |
n/a |
3.1±0.2 |
|||
|
Non Volatile Content |
wt% |
>99.5 |
JIS-C-2103(105℃X2h) |
||
|
Work life @25oC |
hour |
24 |
Q/HZQB-002-2020 |
||
|
Storage life @-40oC |
Month |
12 |
Q/HZQB-002-2020 |
||
| Curing process |
Cure Condition |
1h@175℃ |
|||
|
Weight Loss on Cure @300oC |
<1% |
||||
| Properties after curing |
Chip Die Shear strength |
25℃ |
KgF |
>4 |
chip size: |
|
>15 |
chip size: |
||||
|
160℃ |
>0.5 |
chip size: |
|||
|
>1.0 |
chip size: |
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|
Impurity Ionic Content |
Cl- |
ppm |
5 |
Ion Chromatography |
|
|
Na+ |
ppm |
6 |
|||
|
K+ |
ppm |
5 |
|||
|
Volume Resistivity |
Ω.cm |
3╳1013 |
Curing at 175 ℃ for 1 hour | ||
|
Glass Transition Temperature |
℃ |
90 |
Dynamic Mechanical Analysis |
||
|
Modulus@25℃ |
GPa |
4 |
|||
|
Thermal Conductivity @ 121oC |
W/m·K |
0.5 |
Laser Flash method |
||
|
Coefficient of thermal expansion |
Alpha 1 |
ppm/℃ |
40 |
Thermal Mechanical Analysis |
|
|
Alpha 2 |
ppm/℃ |
120 |
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- Before use, it needs to be thawed at room temperature for 30-60 minutes.
- Please keep the syringe upright throughout the entire process of removing and thawing it from the freezer.
- Do not open the syringe until thawing is complete to prevent moisture from entering.
- After thawing, promptly remove the condensed water on the surface of the syringe.
- After thawing, it should be used as soon as possible.
According to specific requirements, 5cc/10cc needle tube packaging or 100g, 200g can packaging can be provided
-It can be stored for 1 year at 40 ℃. Excessive storage temperature can shorten storage life and affect product performance